Edwards Auto500 Sputter Deposition

This tool is used for sputter deposition of material onto samples. Typically metals are deposited onto a semiconductor or glass.
• Materials such as aluminium, copper, tungsten, vanadium and YIG have been deposited onto silicon.
• The ability to sputter material depends on the availability of targets.
• Layers can be deposited by RF or DC sputtering.
• Three target slots allow multiple depositions to be performed.
• The water cooled workholder is capable of taking up to three 4" wafers at a time.
• The tool is equipped with a thickness monitor for thickness control.